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1 of 15 features applications feature of the device: small package with high efficiency typical view angle: 130 typical green flux output: 39 lm@ 350ma typical red flux output: 33 lm@ 350ma. typical blue flux output: 10 lm@ 350ma esd protection. soldering methods: smt grouping parameter: brightness, forward voltage and chromaticity. moisture sensitivity level: 3 thermal resistance (junction to heat sink): 9 c /w the product itself will remain within rohs compliant version. beacons/ rail crossing and wayside decorative and entertainment illumination indoor or outdoor commercial and residential architectura uplighter/ downlighter/ orientation street lighting materials items description substrate pcb with metal heat sink housing heat resistant polymer encapsulating resin silicone resin electrodes au plating copper alloy die attach silver paste chip blue / green ? ingan red ? inalgap ehp - b 0 2 / grb03 - p 0 3 / tr high power led ? 3w data sheet
ehp-b02/grb03-p03/tr high power led ? 3w 2 of 15 dimensions notes. 1. dimensions are in millimeters. 2. tolerances for fixed dimensions are 0.25mm.
ehp-b02/grb03-p03/tr high power led ? 3w 3 of 15 maximum ratings ( t soldering =25oc ) parameter symbol rating unit dc operating current i f 400 ma green 500 red 550 dc pulse current (1) blue i pf 500 ma esd sensitivity esd 8 kv junction temperature t j 125 c operating temperature t op. -40 ~ +85 c storage temperature t stge. -40 ~ +100 c maximum pulse power dissipation p d 5 w junction to heat-sink thermal resistance r th 9 c /w electro-optical characteristics ( t soldering =25oc ) parameter bin symbol min typ. max unit condition r ---- 33 ---- g ---- 39 ---- brightness (2) b v ---- 10 ---- lm r ---- 2.3 ---- g ---- 3.7 ---- forward voltage (3) b v f ---- 3.4 ---- v r ---- 625 ---- g ---- 525 ---- wavelength (4) b d ---- 462 ---- nm i f =350ma note. 1. tp Q 100 s, duty cycle = 0.25 2. luminous flux measurement tolerance: 10%. 3. forward voltage measurement tolerance: 0.1v. 4. wavelength measurement tolerance : 1nm
ehp-b02/grb03-p03/tr high power led ? 3w 4 of 15 brightness bin table group bin min typ. max 1 1.5 ---- 3 2 3 ---- 4 3 4 ---- 5 4 5 ---- 6 e 5 6 ---- 8 1 8 ---- 10 2 10 ---- 13 3 13 ---- 17 4 17 ---- 20 f 5 20 ---- 23 1 23 ---- 27 2 27 ---- 33 3 33 ---- 39 4 39 ---- 45 j 5 45 ---- 52 group bin min typ. max 1 52 ---- 60 2 60 ---- 70 3 70 ---- 85 4 85 ---- 100 k 5 100 ---- 130 1 130 ---- 160 2 160 ---- 200 3 200 ---- 250 4 250 ---- 300 n 5 300 ---- 400 1 400 ---- 500 2 500 ---- 600 3 600 ---- 750 4 750 ---- 1000 r 5 1000 ---- 1300
ehp-b02/grb03-p03/tr high power led ? 3w 5 of 15 forward voltage bin table ? fine range group bin min typ. max 1 1.75 ---- 1.85 2 1.85 ---- 1.95 u1 3 1.95 ---- 2.05 1 2.05 ---- 2.15 2 2.15 ---- 2.25 u2 3 2.25 ---- 2.35 1 2.35 ---- 2.45 2 2.45 ---- 2.55 u3 3 2.55 ---- 2.65 1 2.65 ---- 2.75 2 2.75 ---- 2.85 u4 3 2.85 ---- 2.95 group bin min typ. max 1 2.95 ---- 3.05 2 3.05 ---- 3.15 v1 3 3.15 ---- 3.25 1 3.25 ---- 3.35 2 3.35 ---- 3.45 v2 3 3.45 ---- 3.55 1 3.55 ---- 3.65 2 3.65 ---- 3.75 v3 3 3.75 ---- 3.85 1 3.85 ---- 3.95 2 3.95 ---- 4.05 v4 3 4.05 ---- 4.15 1 4.15 ---- 4.25 2 4.25 ---- 4.35 v5 3 4.35 ---- 4.45
ehp-b02/grb03-p03/tr high power led ? 3w 6 of 15 wavelength bin table group bin min typ. max 3 440 ---- 445 4 445 ---- 450 5 450 ---- 455 6 455 ---- 460 7 460 ---- 465 b 8 465 ---- 490 1 490 ---- 495 2 495 ---- 500 3 500 ---- 505 4 505 ---- 510 5 510 ---- 515 c 6 515 ---- 520 1 520 ---- 525 2 525 ---- 530 3 530 ---- 535 4 535 ---- 540 5 540 ---- 545 g 6 545 ---- 550 group bin min typ. max 1 580 ---- 582.5 2 582.5 ---- 585 3 585 ---- 587.5 4 587.5 ---- 590 5 590 ---- 592.5 a 6 592.5 ---- 610 3 610 ---- 615 4 615 ---- 620 5 620 ---- 625 6 625 ---- 630 7 630 ---- 635 r 8 635 ---- 640
ehp-b02/grb03-p03/tr high power led ? 3w 7 of 15 relative spectral distribution, i f =350ma, t soldering =25oc forward voltage vs forward current, t soldering =25 o c relative luminous intensity vs forward current, t soldering =25 o c forward current derating curve, derating based on t j max =125 c typical electro-optical characteristics curves 400 500 600 700 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous intenstiy wavelength(nm) 0 100 200 300 400 500 2.0 2.5 3.0 3.5 4.0 4.5 forward voltage(v) forward current(ma) 0 100 200 300 400 500 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 green red blue relative luminous intensity forward current(ma) 0 20 40 60 80 100 120 0 50 100 150 200 250 300 350 400 forward current (ma) lead soldering temperature ( ? c)
ehp-b02/grb03-p03/tr high power led ? 3w 8 of 15 typical representative spatial radiation pattern -80 -60 -40 -20 0 20 40 60 80 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 r b / g relative luminous intensity degree ( 2 ? ) note. 1. 2 1/2 is the off axis angle from lamp centerline where th e luminous intensity is 1/2 of the peak value. 2. view angle tolerance is 5 .
ehp-b02/grb03-p03/tr high power led ? 3w 9 of 15 label explanation cpn: customer?s production number p/n : production number qty: packing quantity cat: rank of luminous flux hue: color rank ref: rank of forward voltage lot no: lot number made in taiwan: production place reel dimensions note. 1. dimensions are in millimeters. 2. tolerances for fixed dimensions are 0.1mm.
ehp-b02/grb03-p03/tr high power led ? 3w 10 of 15 carrier tape dimensions: loaded quantity 300 pcs pe r reel note. 1. dimensions are in millimeters. 2. tolerances for fixed dimensions are 0.1mm. moisture resistant packaging aluminum moistue-proof bag label desiccant label label aluminum moisture-proof bag desiccant label
ehp-b02/grb03-p03/tr high power led ? 3w 11 of 15 reliability data stress test stress condition stress duration reflow tsol=260 , 10sec, 6min 3 times thermal shock h 100 20min. ' 20sec. 'l 10 20min. 200 cycles temperature cycle h 100 30min. ' 5min. 'l 40 30min. 200 cycles power temperature cycle h 85 15min. ' 5min. 'l 40 15min. if= 400 ma , 2min on/off 200 cycles high temperature/humidity storage ta=85 , rh=85% 1000hours high temperature/humidity operation ta=85 , rh=85% , if=225ma 1000hours low temperature operation life ta= -40 , if=350ma 1000hours high temperature operation life #1 ta=25 , if=350ma 1000hours high temperature operation life #2 ta=55 , if=350ma 1000hours high temperature operation life #3 ta=85 , if=225ma 1000hours high temperature storage ta= 110 1000hours low temperature storage ta= -40 1000hours esd human body model 2000v, interval : 0.5sec 3 tim es esd machine model 200v, interval : 0.5sec 3 times *lm: brightness attenuate difference(1000hrs) 30% *vf: forward voltage difference 20%
ehp-b02/grb03-p03/tr high power led ? 3w 12 of 15 precautions for use 1. over-current-proof although the ehp-b02 series has a conductive esd pr otection mechanism, customer must not use the device in reverse and should apply resi stors for extra protection. otherwise, slight voltage shifts may cause significant current change resulting in burn out failure. 2. storage i. do not open the moisture proof bag before the de vices are ready to use. ii. before the package is opened, leds should be st ored at temperatures less than 30 and humidity less than 90%. iii. leds should be used within a year. iv. after the package is opened, leds should be sto red at temperatures less than 30 and humidity less than 60%. v. leds should be used within 168 hours (7 days) af ter the package is opened. vi. if the moisture absorbent material (silicone ge l) has faded away or leds have exceeded the storage time, baking treatment should be implemented based on the following conditions: pre-curing at 805 for 24 hours . 3. thermal management i. for maintaining the high flux output and achievi ng reliability, ehp-b02 series led package should be mounted on a metal core printed c ircuit board (mcpcb) with proper thermal connection to dissipate approximately 5w of thermal energy under 700ma operation. ii. special thermal designs are also recommended to take in outer heat sink design, such as fr4 pcb on aluminum with thermal vias or fpc on aluminum with thermal conductive adhesive, etc. iii. sufficient thermal management must be conducte d, or the die junction temperature will be over the limit under large electronic driving an d led lifetime will decrease critically. recommend : max t slug = 70
ehp-b02/grb03-p03/tr high power led ? 3w 13 of 15 4. proper handling to avoid contamination of materials, damage of inte rnal components, and shortening of led lifetime, do not subject leds to conditions as those listed below. bare hand t weezers when handling the product, do not apply direct pressure on the resin. do not touch the resin to avoid scratching or other damage. pick and place nozzle for surface mount assembly. during module assembly avoid directly contacting with nozzle. do not stack the modules together, it could damage the resin or scratch the lens.
ehp-b02/grb03-p03/tr high power led ? 3w 14 of 15 5. soldering iron i. for reflow process a. ehp-b02 series are suitable for smt b. curing of glue in oven according to standard ope ration flow processes. c. reflow soldering should not be done more than tw ice. d. in soldering process, stress on the leds during heating should be avoided. e. after soldering, do not warp the circuit board.
ehp-b02/grb03-p03/tr high power led ? 3w 15 of 15 revision history current version: 2009/07/16 previous version: 4 page subjects(major change in previous version) date of change 2 revised pattern of soldering 2009.07.16 3 revised operating condition t ambient to t soldering 2009.07.16 7 revised operating condition t ambient to t soldering 2009.07.16 prepared date: 2009.07.16 device no.: dhe-0000123 created by: brady chou rev.: 5.0 for product information and a complete list of dist ributors, please go to our web site www.everlight.com everlight electronics co., ltd. and the logo are trad emarks of everlight electronics co., ltd. in the taiwan and other countr ies. data subject to change. copyright ? 2005-2009 everlight electronics co., ltd. . all rights reserved.

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